Sensor assembly packaging is available for mid (320 × 256) and large (640 × 512) format InGaAs FPAs. A sensor package consists of a SWIR FPA mounted on a thermoelectric cooler (TEC). The FPA and TEC are integrated into a FLIR-designed vacuum package assembly (VPA). The VPA is powered via pins on the back side of the assembly. The system f-number is set by the higher level system optical path.
The system f-number is set by the higher level system optical path. The front window of the dewar has greater than 96% transmission in the 0.9 µm to 1.7 µm waveband. An interface description document shall be provided as part of the delivery.