FLIR – Sensor Assemblies

///FLIR – Sensor Assemblies
  • flir-sensor-assemblies

FLIR – Sensor Assemblies

Sensor assembly packaging is available for mid (320 × 256) and large (640 × 512) format InGaAs FPAs. A sensor package consists of a SWIR FPA mounted on a thermoelectric cooler (TEC). The FPA and TEC are integrated into a FLIR-designed vacuum package assembly (VPA). The VPA is powered via pins on the back side of the assembly. The system f-number is set by the higher level system optical path.

The system f-number is set by the higher level system optical path. The front window of the dewar has greater than 96% transmission in the 0.9 µm to 1.7 µm waveband. An interface description document shall be provided as part of the delivery.

Categories: ,

Product Description

Sensor assembly packaging is available for mid (320 × 256) and large (640 × 512) format InGaAs FPAs. A sensor package consists of a SWIR FPA mounted on a thermoelectric cooler (TEC). The FPA and TEC are integrated into a FLIR-designed vacuum package assembly (VPA). The VPA is powered via pins on the back side of the assembly. The system f-number is set by the higher level system optical path.

The system f-number is set by the higher level system optical path. The front window of the dewar has greater than 96% transmission in the 0.9 µm to 1.7 µm waveband. An interface description document shall be provided as part of the delivery.

Reviews

There are no reviews yet.

Be the first to review “FLIR – Sensor Assemblies”

Your email address will not be published. Required fields are marked *